3M™ Thermally Conductive Tape & Pads

3M™ Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact. The pads consist of highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), Chip ON Film (COF) heat conduction.

3M™ Thermally Conductive Silicone Interface Pads

3M™ Thermally Conductive Silicone Interface Pads perform well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.

3M™ Thermally Conductive Acrylic Interface Pads

3M™ Thermally Conductive Acrylic Interface Pads provide low-outgassing and high-performance solutions compared to silicone. These acrylic pads have no siloxane VOC or oil bleeding, which are associated with silicone products and can often cause device failure. They are lightweight, making them ideal for applications with finer spacing requirements and a small footprint. 3M Acrylic Pads have good electrical insulation properties to protect against electrical interference and device breakdown.

3M™ Thermally Conductive Tapes

3M™ Thermally Conductive Tapes are mixed with conductive fillers such as ceramic, aluminum silicate, or metal. The main role of the adhesive is to form a bond at interconnections. The filler in the adhesives is what helps transport heat away from otherwise hot surfaces and dissipates it to other, non-critical areas of the assembly, usually with the use of a heat sink. The tapes are used often in electronic assemblies such as high-density circuitry or heat sinks. 

 

Maximum service temperature resistance

Image of 3M™ 5514 Thermally Conductive Silicone Interface Pad

Features

  • Available in 0.2 mil to 0.25 mil thickness
  • Good thermal conductivity (1.6 W/m-K)
  • Good converting for complicated shape
  • Hardness: Shore 00 = 58
  • Good flexibility with over bending
  • Good dielectric properties
  • Thin thickness, 0.20 mm and 0.25 mm
  • UL 94 V-1
3M™ 5515 Thermally Conductive Silicone Interface Pad

Features

  • Available in 0.2 mil to .25 mil thickness
  • Good thermal conductivity (3.0 W/m-K)
  • High temperature resistance
  • Hardness: Shore 00 = 80
  • Good converting for complicated shape
  • Good dielectric properties
  • Good flexibility with over bending
  • UL 94 V-0
  • Thin thickness for lower thermal impedance
Image of 3M™ 5516 Thermally Conductive Silicone Interface Pad

Features

  • Available in 0.5 to 2.0 mil thickness
  • Good thermal conductivity and good electrical insulation properties.
  • Good softness and conformability even to non-flat surfaces.
  • Softness results in low stress on board components.
  • “S” version incorporates a thin polymeric film carrier for improved handling and a non-tacky surface for ease of rework.
  • Slight tack allows pre-assembly. Good wettability for better thermal conductivity
Image of 3M™ 5519 Thermally Conductive Silicone Interface Pad

Features

  • Available in 0.5 mil to 2.0 mil thickness
  • Very high thermal conductivity and good electrical insulation properties
  • Good softness and conformability even to non-flat surfaces
  • Good electrical insulation properties
  • Good flame retardant, UL94 V-0 equivalent material
  • Compression relaxation properties help reduce pressure to electric components
  • Slight tack allows pre-assembly
  • Good wettability for improved and lower thermal resistance

Features

  • Available in 0.5 to 1.0 mil thickness
  • Passes UL94 V-0 flammability test
  • No silicone is used in this pad construction, therefore, siloxane gas which often causes electric connection failure cannot be generated
  • Good softness and conformability, even to non-flat IC surfaces
  • Incorporates a thin acrylic layer for good handling
  • Good thermal conductivity, good heat resistance and good electrical insulation properties
  • Slight tack allows pre-assembly. Good wettability for better thermal conductivity
Image of 583S Thermally Conductive Silicone Interface Pad

Features

  • Available in 0.5 mil to 3.0 mil thickness
  • Very good softness and conformability
  • Good thermal conductivity
  • Good electrical insulation properties
  • Compression relaxation properties help reduce pressure to electric components
  • Slight tack allows for pre-assembly
  • Good wettability for improved and lower thermal resistance
3M™ 5589H Thermally Conductive Acrylic Interface Pad

Features

  • Available in 1.0 to 1.5 mil thickness
  • Good softness and conformability to non-flat surfaces.
  • Excellent compressive stress relaxation.
  • High thermal conductivity
  • UL94 V-O certified (File No. E176845)
  • Good surface tack leads to low thermal resistance at surface
  • Non-silicone acrylic elastomer
  • Good dielectric performance
  • Excellent durability for long term thermal conductivity and electric insulation stability
3M™ 5590H Thermally Conductive Acrylic Interface Pad

Features

  • Available in 0.5 mil to 2.0 mil thickness
  • Easy handling and soft pad
  • Highly conformability even for non-flat IC surfaces and automotive EV batteries
  • Incorporates a thin firm acrylic layer for good handling
  • Highly thermally conductive while being electrically insulating
  • Slight tack allows pre-assembly. Good wettability for better thermal conductivity
  • Non-silicone acrylic elastomer
  • Excellent durability for long term conductivity
  • UL94 V-0 listed (File No. E176845)
Image of 3M 8820 Thermal Tape

Features

  • Available in 0.5 mil to 3.0 mil thickness
  • Very good softness and conformability
  • Good thermal conductivity
  • Good electrical insulation properties
  • Compression relaxation properties help reduce pressure to electric components
  • Slight tack allows for pre-assembly
  • Good wettability for improved and lower thermal resistance

Features

  • Available in 0.5 mil to 2.0 mil thickness
  • The specialized silicone chemistry of Interface Pads 5595 and 5595S provides for good thermal stability of the base polymer with excellent softness of the thermal pad.
  • Interface Pad 5595 offers good thermal conductivity in a soft silicone polymer base.
  • Interface Pad 5595S has a permanent PEN film 9 micrometer thick on one side to provide for a non-tacky surface, increased puncture resistance, ease of handling and rework.
Image of 3M 8820 Thermal Tape

Features

  • High mechanical strength
  • Improved surface wet-out for rough/surface/LSE substrates
  • Excellent shock performance
  • Halogen free
  • Ideal for thin bonding applications
  • Good thermal transfer

Features

  • Good thermal conductivity (.1.5W/m-K)
  • Excellent dielectric performance
  • Low thermal impedance
  • Good and reliable adhesion performance to AI and SS
  • Vibration damping
  • Available in 8, 10 and 20 mils
3M™ Thermally Conductive Transfer Tape 8805

Features

  • 5 mil white
  • Thermal conductivity- .60 (W/m-k)
  • Dielectric Strength- 26 (kV/mm)
  • Improved surface wet-out for rough surface/LSE substrates
  • Ideal for thin bonding applications
  • Good thermal transfer
  • High mechanical strength
3M™ Thermally Conductive Transfer Tape 8810

Features

  • 10 mil white
  • Thermal conductivity- .60 (W/m-k)
  • Dielectric Strength- 26 (kV/mm)
  • Improved surface wet-out for rough surface/LSE substrates
  • Ideal for thin bonding applications
  • Good thermal transfer
  • High mechanical strength
3M™ Thermally Conductive Transfer Tape 8815

Features

  • 15 mil white
  • Thermal conductivity- .60 (W/m-k)
  • Dielectric Strength- 26 (kV/mm)
  • Improved surface wet-out for rough surface/LSE substrates
  • Ideal for thin bonding applications
  • Good thermal transfer
  • High mechanical strength
3M™ Thermally Conductive Tape & Pads Toolbox Resources

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