3M™ Thermally Conductive Interface Pads
3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact. The pads consist of highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), Chip ON Film (COF) heat conduction.
3M™ Thermally Conductive Silicone Interface Pads
3M™ Thermally Conductive Silicone Interface Pads perform well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.
3M™ Thermally Conductive Acrylic Interface Pads
3M™ Thermally Conductive Acrylic Interface Pads provide low-outgassing and high-performance solutions compared to silicone. These acrylic pads have no siloxane VOC or oil bleeding, which are associated with silicone products and can often cause device failure. They are lightweight, making them ideal for applications with finer spacing requirements and a small footprint. 3M Acrylic Pads have good electrical insulation properties to protect against electrical interference and device breakdown.
3M™ Thermally Conductive Tapes
3M™ Thermally Conductive Tapes are mixed with conductive fillers such as ceramic, aluminum silicate, or metal. The main role of the adhesive is to form a bond at interconnections. The filler in the adhesives is what helps transport heat away from otherwise hot surfaces and dissipates it to other, non-critical areas of the assembly, usually with the use of a heat sink. The tapes are used often in electronic assemblies such as high-density circuitry or heat sinks.