3M™ 5583S Thermally Conductive Silicone Interface Pad

3M™ Thermally Conductive Silicone Interface Pad 5583S is designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders, or other cooling devices.   3M pad 5583S consists of highly conformable and slightly tacky silicone elastomeric sheet filled with thermally conductive ceramic particles that provide enhanced thermal conductivity and excellent electrical insulation performance.   3M pad 5583S has permanent polyester film 12 µm think on one side to provide for a non-tacky surface, increased puncture resistance, ease of handling and rework.   

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  • 3M™ 5583S Thermally Conductive Silicone Interface Pad


  • Available in 20 mil to 100 mil thickness (0.5 mm to 2.5 mm)
  • Very good softness and conformability
  • Good thermal conductivity
  • Good electrical insulation properties
  • Compression relaxation properties help reduce pressure to electric components
  • Slight tack allows for pre-assembly
  • Good wettability for improved and lower thermal resistance

Typical Applications

  • Integrated chip (IC) packaging heat conduction
  • Heat sink interface
  • Chip on film (COF) heat conduction
  • LED board thermal interface material (TIM)
  • HDTV integrated chip (IC)
  • General gap filling in electronic devices
Data Sheets & Summary Sheets

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