3M™ Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact. The pads consist of highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), Chip ON Film (COF) heat conduction.

3M™ Thermally Conductive Silicone Interface Pads

3M™ Thermally Conductive Silicone Interface Pads perform well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.

3M™ Thermally Conductive Acrylic Interface Pads

3M™ Thermally Conductive Acrylic Interface Pads provide low-outgassing and high-performance solutions compared to silicone. These acrylic pads have no siloxane VOC or oil bleeding, which are associated with silicone products and can often cause device failure. They are lightweight, making them ideal for applications with finer spacing requirements and a small footprint. 3M Acrylic Pads have good electrical insulation properties to protect against electrical interference and device breakdown.

 

3M™ Thermally Conductive Pads

Features

  • Available in 8 mil to 10 mil thickness (0.20 mm and 0.25 mm)
  • Good thermal conductivity (1.6 W/m-K)
  • Good converting for complicated shape

Features

  • Available in 20 to 80 mil thickness (1.0 mm to 2.0 mm)
  • Good thermal conductivity and good electrical insulation properties.
  • Good softness and conformability even to non-flat surfaces.

Features

  • Available in 20 mil to 80 mil thickness (0.5 mm to 2.0 mm)
  • Very high thermal conductivity and good electrical insulation properties
  • Good softness and conformability even to non-flat surfaces

Features

  • Available in 20 to 40 mil thickness (0.5 mm to 1.0 mm)
  • Passes UL94 V-0 flammability test
  • No silicone is used in this pad construction, therefore, siloxane gas which often causes electric connection failure cannot be generated

Features

  • Available in 20 mil to 100 mil thickness (0.5 mm to 2.5 mm)
  • Very good softness and conformability
  • Good thermal conductivity

Features

  • Available in 40 to 60 mil thickness (1.0 mm to 1.5 mm)
  • Good softness and conformability to non-flat surfaces.
  • Excellent compressive stress relaxation.

Features

  • Available in 20 mil to 60 mil thickness (0.5 mm to 1.5 mm)
  • Easy handling and soft pad
  • Highly conformability even for non-flat IC surfaces and automotive EV batteries
Image of 3M 8820 Thermal Tape

Features

  • Available in 40 mil to 100 mil thickness (1.0 mm to 2.0 mm)
  • Very good softness and conformability
  • Good thermal conductivity

Features

  • Available in 20 mil to 80 mil thickness (0.5 mm to 2.0 mm)
  • Good thermal stability of the base polymer with excellent softness of the thermal pad.
  • Good thermal conductivity in a soft silicone polymer base.

Search form

×