3M™ 5591 Thermally Conductive Silicone Interface Pad

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3M™ Thermally Conductive Silicone Interface Pad 5591 is designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. 

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  • 3M™ 5591 Thermally Conductive Silicone Interface Pad


  • Available in 40 mil to 100 mil thickness (1.0 mm to 2.0 mm)
  • Very good softness and conformability
  • Good thermal conductivity
  • Good electrical insulation properties
  • Compression relaxation properties help reduce pressure to electric components
  • Slight tack allows for pre-assembly
  • Good wettability for improved and lower thermal resistance

Typical Applications

  • Integrated chip (IC) packaging heat conduction
  • Heat sink interface
  • Chip on film (COF) heat conduction
  • LED board thermal interface material (TIM)
  • HDTV integrated chip (IC)
  • General gap filling in electronic devices
Data Sheets & Summary Sheets

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