3M™ 5519 Thermally Conductive Silicone Interface Pad

3M™ Thermally Conductive Silicone Interface Pad (TCSIP) 5519 is designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. 3M TCSIP 5519 consists of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles, which helps provide enhanced thermal conductivity and excellent electrical insulation performance.

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  • 3M™ 5519 Thermally Conductive Silicone Interface Pad


  • Available in 20 mil to 80 mil thickness (0.5 mm to 2.0 mm)
  • Very high thermal conductivity and good electrical insulation properties
  • Good softness and conformability even to non-flat surfaces
  • Good electrical insulation properties
  • Good flame retardant, UL94 V-0 equivalent material
  • Compression relaxation properties help reduce pressure to electric components
  • Slight tack allows pre-assembly
  • Good wettability for improved and lower thermal resistance

Typical Applications

  • Integrated chip (IC) packaging heat conduction
  • Heat sink interface
  • Chip on film (COF) heat conduction
  • LED board thermal interface material (TIM
  • HDTV integrated chip (IC)
  • General gap filling in electronic device
Data Sheets & Summary Sheets

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