3M™ 5595 and 5595S Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads 5595 and 5595S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices. Inteface Pad 5592- 9 µm has a PEN film liner. 

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  • 3M™ 5595 and 5595S Thermally Conductive Interface Pads


  • Available in 20 mil to 80 mil thickness (0.5 mm to 2.0 mm)
  • Good thermal stability of the base polymer with excellent softness of the thermal pad.
  • Good thermal conductivity in a soft silicone polymer base.
  • The product tack is such that a mechanical means to support the pad in a final assembly is required.
  • This "S" version has a permanent PEN film, 9 micrometer thick, on one side to provide for a non-tacky surface, increased puncture resistance, ease of handling and rework.

Typical Applications

  • Heat transfer between PCB and heat sink
  • Integrated chip (IC) packaging heat conduction
  • Chip on film (COF) heat dissipation
  • Gap filling in electronic devices
  • Decrease of compression stress to electronic parts by thermal pad softness
Data Sheets & Summary Sheets

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