Press Releases

Stay on top of your market with the latest news and announcements from Tekra and our vendor partners such as 3M, Mylar® Specialty Films (formerly DuPont Teijin Films™), and POLYVANTIS, (formally known as SABIC Innovative Plastics). Be the first to find the announcements that are sent out to all the industry publications for release and stay one step ahead of your competition. All press releases are archived here too, so you can always refer back to them at any time.

Press Release - 2016 SGIA Expo Recap - Inkjet Films Revolution

October 2016
The 2016 SGIA Expo featured the latest in technology and trends with a focus on the digital inkjet marketplace. This show recap highlights some of the main takeaways form the show along with the most popular offerings, such as inkjet films, from Tekra's own booth.

Press Release - Introducing 3M™ Foam Lamination Tapes - Available NOW at Tekra!

May 2016
3M™ Foam Lamination Tapes are available at Tekra today!

Press Release - 3M™ Low VOC Tapes with Acrylic Adhesive are Now Available at Tekra

May 2016
3M™ Low VOC Tapes with Acrylic Adhesive provide thin attachment solutions for automotive interior applications.
Sales representative assisting customers

Press Release - Tekra had Great Success at the 2015 SGIA Expo!

November 2015
Tekra staff were kept busy at the 2015 SGIA Expo in Atlanta, GA last week providing solutions to their customers' film and adhesive needs.
Tekra is a 3M Master Converter

Press Release - Named Master Converter by 3M Converter Markets

December 2014
3M Converter Markets has named Tekra a Master Converter.

Press Release - New 3M™ Dual Lock™ Reclosable Fasteners Offered By Tekra

January 2011
Tekra announces the addition of 3M™ Dual Lock™ Reclosable Fasteners to their extensive distribution line of 3M products.

Press Release - Tekra Introduces 3M™ Quick Bonding Adhesive 360 Product Family

January 2011
3M™ High Performance Quick Stick Acrylic Adhesive 360 is available in transfer tape and double coated options through Tekra. The tapes bond well to both high and low surface energy substrates using less adhesive resulting in thinner bond lines.

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