In printed electronics, the requirement for more current carrying capacity in smaller footprints, continues to drive the need for highly conductive materials. LOCTITE® ECI 1010 E&C and LOCTITE®ECI 1011 E&C are two versatile silver ink compositions available from Tekra. Both products allow for design flexibility, increased conductivity, and permit the deposition of thinner lines and thinner print thickness - resulting in material savings.
LOCTITE® ECI 1010 E&C
This highly conductive silver ink is suitable for both screen and rotary screen printing. LOCTITE® ECI 1010 E&C combines excellent conductivity with optimum mechanical strength and flexibility.
| Key Benefits | LOCTITE® ECI 1010 E&C |
|---|---|
| Cost savings | Standard silver ink with very low resistance, permits thinner layers/narrower lines. |
| Power output | Low resistance allows high power generation in heating elements. |
| Mechanical | Low resistance increase after double crease and mandrel tests. |
| Environmental stability | Limited resistance increase when exposed to higher temperatures or 85%RH/85°C. |
LOCTITE® 1011 E&C
This highly conductive submicron silver ink is screen and flexo printable. The silver pigment is partly sintering resulting in optimum sheet resistance for excellent current carrying capacity.
| Key Benefits | LOCTITE® ECI 1011 E&C |
|---|---|
| Cost savings | Very conductive silver, permits thinner line deposition. |
| Power output | Very low resistance allows high power generation in heating elements. |
| Resolution | Small particle size allows application of fine structures. |
| High speed printable | Excellent flexo printability with high conductive layers. |
| Environmental stability | Very low resistance gain when exposed to higher temperatures or 85%RH/85°C. |
Optimized for design functionality, LOCTITE® ECI 1010 & 1011 can be utilized in a myriad of printed electronics applications, including: flexible circuits, membrane switches, smart card applications, RFID, and other related electronic applications. For additional information, please click here.
