3M™ Electronics Assembly Solutions
3M™ Thermally Conductive Adhesives are mixed with conductive fillers such as ceramic, aluminum silicate or metal. The main role of the adhesive is to form a bond at interconnections. The filler in the adhesives is what helps transport heat away from otherwise hot surfaces and dissipates it to other, non-critical areas of the assembly, usually with use of a heat sink. The tapes are used often in electronic assemblies such as high-density circuitry or heat sinks. As with other adhesive solutions, 3M™ Thermally Conductive Adhesives Transfer Tapes provide an alternative to other forms of assembly attachment such as screws or rivets.
3M™ Electrically Conductive Adhesive Transfer Tapes are designed for use in a variety of electronics assembly operations where components need to be held in place while, at the same time, allowing electrical current to pass through them. They are commonly used to attach EMI (electromagnetic interference)/RFI (radio-frequency interference) shields to devices as well as connecting and/or bonding various substrates together for grounding application needs.