Thermal Tapes for High-Density Circuitry and Heat Sinks

3M™ Thermally Conductive Tapes are mixed with conductive fillers such as ceramic, aluminum silicate, or metal. The main role of the adhesive is to form a bond at interconnections. The filler in the adhesives is what helps transport heat away from otherwise hot surfaces and dissipates it to other, non-critical areas of the assembly, usually with the use of a heat sink. The tapes are used often in electronic assemblies such as high-density circuitry or heat sinks.

 

3M™ Thermally Conductive Tape

Dielectric Strength V/mil (kV/mm)

Thermal Conductivity (W/m-k)

Features

  • High mechanical strength
  • Improved surface wet-out for rough/surface/LSE substrates
  • Excellent shock performance
3M™ Thermally Conductive Transfer Tape 8805

Features

  • 5 mil white
  • Thermal conductivity- .60 (W/m-k)
  • Dielectric Strength- 26 (kV/mm)
3M™ Thermally Conductive Transfer Tape 8810

Features

  • 10 mil white
  • Thermal conductivity- .60 (W/m-k)
  • Dielectric Strength- 26 (kV/mm)
3M™ Thermally Conductive Transfer Tape 8815

Features

  • 15 mil white
  • Thermal conductivity- .60 (W/m-k)
  • Dielectric Strength- 26 (kV/mm)

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