Thermal Tapes for High-Density Circuitry and Heat Sinks

3M™ Thermally Conductive Tapes are mixed with conductive fillers such as ceramic, aluminum silicate, or metal. The main role of the adhesive is to form a bond at interconnections. The filler in the adhesives is what helps transport heat away from otherwise hot surfaces and dissipates it to other, non-critical areas of the assembly, usually with the use of a heat sink. The tapes are used often in electronic assemblies such as high-density circuitry or heat sinks.

 

3M™ Thermally Conductive Tape

Thickness Mils (Caliper)

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