3M™ Electronics Adhesives

3M™ Thermally Conductive Adhesives are mixed with conductive fillers such as ceramic, aluminum silicate or metal. The main role of the adhesive is to form a bond at interconnections. The filler in the adhesives is what helps transport heat away from otherwise hot surfaces and dissipates it to other, non-critical areas of the assembly, usually with use of a heat sink. The tapes are used often in electronic assemblies such as high-density circuitry or heat sinks. As with other adhesive solutions, 3M™ Thermally Conductive Adhesives Transfer Tapes provide an alternative to other forms of assembly attachment such as screws or rivets.

3M™ Electrically Conductive Adhesive Transfer Tapes are designed for use in a variety of electronics assembly operations where components need to be held in place while, at the same time, allowing electrical current to pass through them. They are commonly used to attach EMI (electromagnetic interference)/RFI (radio-frequency interference) shields to devices as well as connecting and/or bonding various substrates together for grounding application needs.

Check out the 3M™ Converter Markets Selection Guide for more product details.

3M™ Electronics Assembly Solutions Products

Maximum service temperature resistance

3M™ Thermally Conductive Transfer Tape 8805

Features

  • 5 mil white
  • Thermal conductivity- .60 (W/m-k)
  • Dielectric Strength- 26 (kV/mm)
  • Improved surface wet-out for rough surface/LSE substrates
  • Ideal for thin bonding applications
  • Good thermal transfer
  • High mechanical strength
3M™ Thermally Conductive Transfer Tape 8810

Features

  • 10 mil white
  • Thermal conductivity- .60 (W/m-k)
  • Dielectric Strength- 26 (kV/mm)
  • Improved surface wet-out for rough surface/LSE substrates
  • Ideal for thin bonding applications
  • Good thermal transfer
  • High mechanical strength
3M™ Thermally Conductive Transfer Tape 8815

Features

  • 15 mil white
  • Thermal conductivity- .60 (W/m-k)
  • Dielectric Strength- 26 (kV/mm)
  • Improved surface wet-out for rough surface/LSE substrates
  • Ideal for thin bonding applications
  • Good thermal transfer
  • High mechanical strength

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